الطلاء الكهربائي ل Ag و Sn و Mn من السوائل الايونية

Electrodeposition of Ag, Sn and Mn from ionic liquids

Electrodeposition of metals has been used in the automotive and aerospace industries. Physical and mechanical properties of metal tools can be improved by depositing with metals have high resistance to corrosion. Sn, Ag and Mn are generally used for corrosion protective of steel plates or other metal pieces. Electrodeposition of metals was previously achieved in aqueous solution. However, the disadvantages of aqueous solutions limited the deposition of metals. The main objective of this study was to use of the green solvent (Ethaline200) during electrodeposition of Sn, Ag, and Mn with enhancement the quality of coating by using additives. In this work the effects of temperature and additives on the electrodeposition of Sn, Ag and, Mn from Ethaline 200 have been investigated. It was found that high temperature significantly effected on the morphology of Sn deposit, where produced homogenous film. Boric acid (BA) has improved the morphology of Sn. Moreover, the electrodeposition of Sn on different metallic substrate (copper, mild steel, and brass) has been achieved. Ag electrodeposition from Ethaline 200 (1ChCl:2EG) has been studied on different metallic substrate (copper, brass, and mild steel). it was found that type of substrate significantly affected the Ag deposits. electrodeposition of Ag more preferable on copper and copper alloy substrate than mild steel was observed.
The effects of potassium bromide (KBr) as inorganic additive on the electrodeposition of Mn from Ethaline 200 has been examined, and enhancement in the Mn deposition can be shown. Electrochemical properties of the plating liquid have been studied using cyclic voltammetry and the resultant surface characteristics such as morphology, composition and thickness were revealed by SEM/EDXS and AFM. XRD was used to examine the crystal structure of the Sn, Ag and Mn.